| CAS登录号 | 中文名 | 英文名 | 分子结构式 | 分子式 | 详情 | 供应商 |
| 67989-88-2 | EDTA-铜铵络合物; 乙二胺四乙酸铜二铵 | Ethylenediaminetetraacetate-copper-ammonia complex; Ethylenediaminetetraacetic acid diammonium copper salt | ![]() | C10H20CuN4O8 | 详情 | 供应商 |
| 67689-49-0 | [N,N',N'',N'''-四[3-(二甲氨基)丙基]-29H,31H-酞菁-C,C,C,C-四磺酰胺合铜-N29,N30,N31,N32]络合物 | [N,N',N'',N'''-tetrakis[3-(dimethylamino)propyl]-29H,31H-phthalocyanine-C,C,C,C-tetrasulfonamCopper | 无 | C52H64CuN16O8S4 | 详情 | 供应商 |
| 93971-95-0 | 29H,31H-酞菁磺酰胺-N-[3-(二乙氨基)丙基]铜络合物 | 29H, 31H-Phthalocyaninesulfonamide, N-[3-(diethylamino) propyl]-copper complex(9Cl); Copper,[N-[3-(diethylamino)propyl]-29H,31H-phthalocyanine-C-sulfonamidato(2-)-N29,N30,N31,N32]-; 29H,31H-Phthalocyanine-C-sulfonamide, N-[3-(diethylamino)propyl]-, coppercomplex | ![]() | C39H32CuN10O2S | 详情 | 供应商 |
| 34836-53-8 | 碘化铜三甲基亚磷酸络合物 | Copper, iodo(trimethylphosphite-kP)- (9CI); (Trimethylphosphite)copper iodide (7CI); Copper, iodo(phosphorous acid)-, trimethyl ester(8CI); Copper, iodo(trimethyl phosphite-P)-; Iodo(trimethyl phosphite)copper | ![]() | C3H9CuI2O3P | 详情 | 供应商 |
| 23299-85-6 | 铜-PAN络合物(CU-EDTA+PAN) | COPPER PAN (CU-EDTA + PAN); COPPER PAN (CU-EDTA + PAN); COPPER PAN GR; Copper(II)bis[1-(2-pyridylazo)naphthalene-2-olate] | 无 | C30H20CuN6O2 | 详情 | 供应商 |
| 51913-38-3 | 三氟甲烷磺酸铜与甲苯的络合物; 三氟甲烷磺酸铜与甲苯的络合物 | COPPER(I) TRIFLUOROMETHANESULFONATE | ![]() | CCuF3O3S | 详情 | 供应商 |